ASMPT Could See Strong Advanced Packaging Demand Ahead -- Market Talk

Dow Jones10:15

0215 GMT - ASMPT could see strong advanced packaging demand ahead, Citi analysts say in a research note. Its 1Q results were well above expectations, driven by strength in the semiconductor solutions segment, which includes chip assembly and packaging, as well as its surface mount technology segment. Shares rise 7% to HK$158.00 after the results. Meanwhile, the company's 2Q revenue guidance of US$540 million-US$600 million is better than expected, even at the low end, the analysts say. ASMPT's book-to-bill ratio rose to 1.43% from 1.05% in 4Q, with strong bookings suggesting robust revenue growth ahead, they add. Citi has an upside catalyst watch on the stock expiring May 15. (sherry.qin@wsj.com)

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April 21, 2026 22:15 ET (02:15 GMT)

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