Chip Testing Becoming More Complex in AI Era, AEM CEO Says -- Market Talk

Dow Jones05-07

0533 GMT - Chip testing has become more complex in the AI era, AEM chief executive Samer Kabbani says. Speaking at SEMICON Southeast Asia, Kabbani says that the transition from one big chip to multiple chiplets in a package--a shift stemming from higher computing needs--means that each piece could be designed by different teams or companies. "As a test supplier, it's very difficult to know who is driving this bus," he says. Meanwhile, AI development has accelerated new product rollouts, shortening the span from one generation to the next to around six months, he adds. For test providers like AEM, that means that "all of a sudden you could get a package that's double the size and complexity of different heights." (sherry.qin@wsj.com)

(END) Dow Jones Newswires

May 07, 2026 01:34 ET (05:34 GMT)

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For test providers like AEM, that means that \"all of a sudden you could get a package that's double the size and complexity of different heights.\" (sherry.qin@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  May 07, 2026 01:34 ET (05:34 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0498741114.HKD","symbol_name":"FRANKLIN GOLD & PRECIOUS METALS \"A\" (HKD) ACC","start_time":0,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","article_id":"2633997011","we_media_id":"106","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2633997011","pubTimestamp":1778132040,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Dow Jones","introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"summary":"0533 GMT - Chip testing has become more complex in the AI era, AEM chief executive Samer Kabbani says. 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Speaking at SEMICON Southeast Asia, Kabbani says that the transition from one big chip to multiple chiplets in a package--a shift stemming from higher computing needs--means that each piece could be designed by different teams or companies. \"As a test supplier, it's very difficult to know who is driving this bus,\" he says. Meanwhile, AI development has accelerated new product rollouts, shortening the span from one generation to the next to around six months, he adds. 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