Techtronic Industries (HKG:0669) applied to list a $500 million medium-term bond program on the Hong Kong Stock Exchange, according to a Monday bourse filing.
Shares of the home appliance maker were down over 2% in Tuesday morning trade.
The company said the bonds may be issued to professional investors under the program during the 12 months following May 18.
The program is expected to be listed on Tuesday.
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