Huawei Chip Design Approach Offers Scalable Roadmap for China Chip Industry -- Market Talk

Dow Jones05-26 10:51

0251 GMT - Huawei Technologies' new chip design approach offers a scalable roadmap to guide the Chinese semiconductor industry to go beyond equipment constraint and continuously improve over the next decade, Bernstein analysts say in a note. Just like DeepSeek's innovation on algorithm encouraged China to invest in artificial intelligence, Huawei's new approach should give the industry a lot more confidence to invest in domestic semiconductor players, they say. Bernstein likes Semiconductor Manufacturing International Corp., Naura Technology and Piotech. With the new roadmap, SMIC could execute advanced logic and packaging manufacturing, Naura could deliver the tools for advanced logic fabrication and Piotech could support the bonding tools for Huawei's LogicFolding architecture, Bernstein says. (sherry.qin@wsj.com)

(END) Dow Jones Newswires

May 25, 2026 22:51 ET (02:51 GMT)

At the request of the copyright holder, you need to log in to view this content

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap

Leave a comment

{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/2638562826?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-05-26 10:51","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2638562826","market":"sg","top_or_hot":-1,"title":"Huawei Chip Design Approach Offers Scalable Roadmap for China Chip Industry -- Market Talk","media":"Dow Jones","content":"<font class=\"NormalMinus1\" face=\"Arial\">\n<p>\n     0251 GMT - Huawei Technologies' new chip design approach offers a scalable roadmap to guide the Chinese semiconductor industry to go beyond equipment constraint and continuously improve over the next decade, Bernstein analysts say in a note. Just like DeepSeek's innovation on algorithm encouraged China to invest in artificial intelligence, Huawei's new approach should give the industry a lot more confidence to invest in domestic semiconductor players, they say. Bernstein likes <a href=\"https://laohu8.com/S/688981\">Semiconductor Manufacturing</a> International Corp., Naura Technology and Piotech. With the new roadmap, SMIC could execute advanced logic and packaging manufacturing, Naura could deliver the tools for advanced logic fabrication and Piotech could support the bonding tools for Huawei's LogicFolding architecture, Bernstein says. (sherry.qin@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  May 25, 2026 22:51 ET (02:51 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Huawei Chip Design Approach Offers Scalable Roadmap for China Chip Industry -- Market Talk</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHuawei Chip Design Approach Offers Scalable Roadmap for China Chip Industry -- Market Talk\n</h2>\n\n<h4 class=\"meta\">\n\n\n<div class=\"head\" \">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Dow Jones </p>\n<p class=\"h-time\">2026-05-26 10:51</p>\n</div>\n\n</div>\n\n\n</h4>\n\n</header>\n<article>\n<font class=\"NormalMinus1\" face=\"Arial\">\n<p>\n     0251 GMT - Huawei Technologies' new chip design approach offers a scalable roadmap to guide the Chinese semiconductor industry to go beyond equipment constraint and continuously improve over the next decade, Bernstein analysts say in a note. Just like DeepSeek's innovation on algorithm encouraged China to invest in artificial intelligence, Huawei's new approach should give the industry a lot more confidence to invest in domestic semiconductor players, they say. Bernstein likes <a href=\"https://laohu8.com/S/688981\">Semiconductor Manufacturing</a> International Corp., Naura Technology and Piotech. With the new roadmap, SMIC could execute advanced logic and packaging manufacturing, Naura could deliver the tools for advanced logic fabrication and Piotech could support the bonding tools for Huawei's LogicFolding architecture, Bernstein says. (sherry.qin@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  May 25, 2026 22:51 ET (02:51 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2148510915.USD","symbol_name":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"R\" (USD) ACC","start_time":0,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","article_id":"2638562826","we_media_id":"106","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2638562826","pubTimestamp":1779763860,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Dow Jones","introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"summary":"0251 GMT - Huawei Technologies' new chip design approach offers a scalable roadmap to guide the Chinese semiconductor industry to go beyond equipment constraint and continuously improve over the next decade, Bernstein analysts say in a note. Just like DeepSeek's innovation on algorithm encouraged China to invest in artificial intelligence, Huawei's new approach should give the industry a lot more confidence to invest in domestic semiconductor players, they say. Bernstein likes Semiconductor Manufacturing International Corp., Naura Technology and Piotech. With the new roadmap, SMIC could execute advanced logic and packaging manufacturing, Naura could deliver the tools for advanced logic fabrication and Piotech could support the bonding tools for Huawei's LogicFolding architecture, Bernstein says. ","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"688072":"拓荆科技","688981":"中芯国际","LU2148510915.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"R\" (USD) ACC","SG9999003461.SGD":"United Asia Pacific Infrastructure SGD","BK0188":"融资融券","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU1820825898.SGD":"Aberdeen Standard SICAV I - China A Share Equity A Acc SGD-H","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","BK1163":"半导体产品","LU2289578879.USD":"ALLIANZ CHINA A OPPORTUNITIES \"AT\" (USD) ACC","LU1655091616.SGD":"JPMorgan Funds - China A-Share Opportunities A (acc) SGD","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","LU1328615791.USD":"FULLERTON LUX FUNDS - ALL CHINA EQUITIES \"I\" (USD) ACC","LU1251922891.USD":"NINETY ONE GSF ALL CHINA EQUITY \"A\" (USD) ACC","BK0028":"国家队","BK0251":"专用设备","LU1997245177.USD":"安联神洲A股基金","LU2328871848.SGD":"Eastspring Investments - China A Shares Growth AS SGD","LU1064130708.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"I\" (USD) ACC","LU0823437842.USD":"PARVEST GREEN TIGERS \"C\" (USD) INC","BK1610":"ETF&股票定投概念","LU1720050803.USD":"安联全方位中国股票基金","BK0125":"芯片国产化","BK1526":"科网股","LU0572944931.SGD":"Janus Henderson Horizon China Opportunities A2 SGD","LU1039395188.USD":"BNP PARIBAS GREEN TIGERS \"C\" (USD) ACC","LU1961090484.USD":"ALLIANZ ALL CHINA EQUITY \"A\" (USD) INC","LU1303224171.USD":"NINETY ONE GSF ALL CHINA EQUITY \"A\" (USD) INC","SG9999006597.SGD":"United China-India Dynamic Growth SGD","002371":"北方华创","LU1255011170.USD":"JPM CHINA A-SHARE OPPORTUNITIES \"A\" (USD) ACC","LU1719994722.HKD":"NINETY ONE GSF ALL CHINA EQUITY \"A\" (HKD) ACC","LU2476274308.USD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"AT\" (USD) ACC","BK1607":"新IT概念","BK1614":"港股-半导体","SG9999001093.SGD":"United Greater China Fund A Acc SGD","LU2506952253.HKD":"BNP PARIBAS GREEN TIGERS \"CRH\" (HKD) ACC","LU1794554557.SGD":"Allianz All China Equity AT Acc H2-SGD","00981":"中芯国际","LU1770034418.SGD":"ALL CHINA EQUITY \"A\" (SGDHDG) ACC","LU2778985437.USD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"A\" (USD) INC","LU1997245094.SGD":"安联神州A股基金AT Acc SGD","LU2476274720.SGD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"AT\" (SGDHDG) ACC","LU2495084118.USD":"ALLIANZ CHINA A-SHARES \"ATH\" (USDHDG) ACC","LU1969619763.USD":"EASTSPRING INV CHINA A SHARES GROWTH \"A\" (USD) ACC","LU0327786744.USD":"Janus Henderson Horizon China Opportunities A2 USD","LU1064131003.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"A\" (USD) ACC","LU1146622755.USD":"安本中国A股股票基金A Acc","LU1997244956.HKD":"ALLIANZ CHINA A-SHARES \"AT\" (HKD) ACC A","SGXZ81163826.USD":"UNITED CHINA A-SHARES INNOVATION \"A\" (USD) ACC","SGXZ49509284.SGD":"United China A Shares Innovation A Acc SGD","LU2399975544.HKD":"ALLIANZ ALL CHINA EQUITY \"AT\" (HKD) ACC"},"translate_title":"华为芯片设计方法为中国芯片产业提供可扩展的路线图——市场谈","themeId":null,"isJumpTheme":false,"ttsUrl":"https://static.tigerbbs.com/d676d369bb20516101b1e49aa822641d","symbols_score_info":{"688072":1.84,"688981":1.86,"00981":1.86,"002371":1.85},"content_text":"0251 GMT - Huawei Technologies' new chip design approach offers a scalable roadmap to guide the Chinese semiconductor industry to go beyond equipment constraint and continuously improve over the next decade, Bernstein analysts say in a note. Just like DeepSeek's innovation on algorithm encouraged China to invest in artificial intelligence, Huawei's new approach should give the industry a lot more confidence to invest in domestic semiconductor players, they say. Bernstein likes Semiconductor Manufacturing International Corp., Naura Technology and Piotech. With the new roadmap, SMIC could execute advanced logic and packaging manufacturing, Naura could deliver the tools for advanced logic fabrication and Piotech could support the bonding tools for Huawei's LogicFolding architecture, Bernstein says. (sherry.qin@wsj.com) \n\n\n \n\n\n  (END) Dow Jones Newswires\n\n\n  May 25, 2026 22:51 ET (02:51 GMT)\n\n\n  Copyright (c) 2026 Dow Jones & Company, Inc.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":true,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.42.2","shortVersion":"4.42.2","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2638562826","isCrawlerRequest":true}