0453 GMT - Providers of advanced packaging equipment and services are likely to be key beneficiaries of Huawei's new chip-design approach, Citi analysts say in a research note. The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers ASMPT for its broadening advanced-packaging-solution offerings. (sherry.qin@wsj.com)
(END) Dow Jones Newswires
May 27, 2026 00:53 ET (04:53 GMT)
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