Hon Hai Precision Industry (TPE:2317), also known as Foxconn, will start shipping co-packaged optics (CPO) switch trays for AI infrastructure this year, targeting about 10,000 units and more than doubling volumes by 2027, Nikkei Asia reported Friday, citing Chairman Young Liu.
Liu said demand for faster data transmission is rising sharply alongside growing AI computing power, driving strong uptake for next-generation optical technologies used in data centers, according to the report.
The technology, developed in collaboration with key industry players including Nvidia, is being produced at Foxconn's Vietnam facility, with shipments expected to begin from the third quarter as the firm expands its AI server footprint, the news outlet said.
(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)
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