Amkor Technology, Taiwan Semiconductor Sign 10-Year Partnership on Advanced Semiconductor Packaging

MT Newswires Live06-16 21:43

Taiwan Semiconductor Manufacturing (TSM) and Amkor Technology (AMKR) signed a 10-year partnership agreement on advanced semiconductor packaging capabilities in Arizona, the companies said Tuesday.

The deal sets a collaboration framework for Taiwan Semiconductor to procure advanced packaging and testing services from Amkor for a more resilient semiconductor supply chain, the companies said.

No financial details were disclosed.

Price: 439.74, Change: -1.12, Percent Change: -0.25

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap
Leave a comment