Forehope Electronic (SHA:688362) will invest 10.3 billion yuan in an integrated circuit packaging and testing project in Ningbo, Zhejiang, China, according to a Monday filing with the Shanghai bourse.
The project will utilize chip packaging technologies such as BUMP, 2.5D packaging, flip chip, and wire bonding.
Forehope's project is set to span 96 months or eight years and will be set up at the SIno-Italian Ningbo Eco-Park.
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