Market Chatter: TSMC to Build Three Advanced Packaging Facilities

MT Newswires Live07-13 11:00

Taiwan Semiconductor Manufacturing or TSMC (TPE:2330) plans to build three additional advanced packaging facilities at the Chiayi Science Park in Taiwan, Focus Taiwan reported Sunday, citing a groundbreaking ceremony.

Wu Cheng-wen, the head of National Science and Technology Council, said the site will be developed into an advanced packaging cluster by TSMC, the report said.

The facilities would be Phase 2 of the plans, with Phase 1 already boasting two advanced packaging facilities which began production in June, the report said.

Once both phases are fully operations, companies with facilities at the site could generate more than NT$300 billion in annual output, Wu reportedly said.

TSMC did not immediately respond to MT Newswires' request for comment.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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