Hanmi Semiconductor Plans New Product Launches and U.S. Expansion

MT Newswires Live07-20

Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.

The semiconductor company aims to release a second-generation hybrid bonder prototype by year-end, with factory operations slated for early 2027, according to a bourse filing on Monday.

Simultaneously, Hanmi is pursuing the establishment of a U.S. subsidiary in the second half of the year to enter the American AI semiconductor market, including terafab facilities.

In terms of specific new products, Hanimi plans to launch the BOC COB Bonder for stacked memory, the 2.5D Thermal Compression (TC) Bonder for AI system semiconductors, and a Wide TC Bonder.

Hanmi has also doubled its corporate governance compliance rate year-over-year and conducted tax-free dividends for fiscal 2025, achieving an 11.1% growth in total dividends and a 35.5% payout ratio.

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{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/2652295277?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-07-20 16:25","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2652295277","market":"us","top_or_hot":-1,"title":"Hanmi Semiconductor Plans New Product Launches and U.S. Expansion","media":"MT Newswires Live","content":"<html><body><p> Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.</p><p>The semiconductor company aims to release a second-generation hybrid bonder prototype by year-end, with factory operations slated for early 2027, according to a bourse filing on Monday.</p><p>Simultaneously, Hanmi is pursuing the establishment of a U.S. subsidiary in the second half of the year to enter the American AI semiconductor market, including terafab facilities.</p><p>In terms of specific new products, Hanimi plans to launch the BOC COB Bonder for stacked memory, the 2.5D Thermal Compression (TC) Bonder for AI system semiconductors, and a Wide TC Bonder.</p><p>Hanmi has also doubled its corporate governance compliance rate year-over-year and conducted tax-free dividends for fiscal 2025, achieving an 11.1% growth in total dividends and a 35.5% payout ratio.</p></body></html>","source":"mtnewswires_news","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Hanmi Semiconductor Plans New Product Launches and U.S. Expansion</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHanmi Semiconductor Plans New Product Launches and U.S. Expansion\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1092851196\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/3002d84abbd5ace3c99397c7f95b8d4e);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">MT Newswires Live </p>\n<p class=\"h-time\">2026-07-20 16:25</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><body><p> Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.</p><p>The semiconductor company aims to release a second-generation hybrid bonder prototype by year-end, with factory operations slated for early 2027, according to a bourse filing on Monday.</p><p>Simultaneously, Hanmi is pursuing the establishment of a U.S. subsidiary in the second half of the year to enter the American AI semiconductor market, including terafab facilities.</p><p>In terms of specific new products, Hanimi plans to launch the BOC COB Bonder for stacked memory, the 2.5D Thermal Compression (TC) Bonder for AI system semiconductors, and a Wide TC Bonder.</p><p>Hanmi has also doubled its corporate governance compliance rate year-over-year and conducted tax-free dividends for fiscal 2025, achieving an 11.1% growth in total dividends and a 35.5% payout ratio.</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"VGT","symbol_name":"信息技术ETF-Vanguard","start_time":0,"source_url":"https://www.mtnewswires.com/","article_id":"2652295277","we_media_id":"1092851196","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2652295277","pubTimestamp":1784535940,"columns":[],"sourceInfo":{"source_id":"mtnewswires_news","name":"MT Newswires"},"weMediaInfo":{"media_name":"MT Newswires Live","introduction":"The most recognized names in North America, Europe and Asia rely on MT Newswires to power their applications. Better news, better service, better price.","home_visible":1,"id":"1092851196","head_image":"https://community-static.tradeup.com/news/3002d84abbd5ace3c99397c7f95b8d4e"},"summary":"Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.The semic","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"VGT":"信息技术ETF-Vanguard","BK4211":"区域性银行","BK4588":"碎股","TC":"Token Cat Ltd","BK4585":"ETF&股票定投概念","BK4009":"广告","HAFC":"韩美金融"},"translate_title":"韩美半导体计划推出新产品并在美国扩张","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"VGT":0.66,"HAFC":1.5,"TC":1},"content_text":"Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.The semiconductor company aims to release a second-generation hybrid bonder prototype by year-end, with factory operations slated for early 2027, according to a bourse filing on Monday.Simultaneously, Hanmi is pursuing the establishment of a U.S. subsidiary in the second half of the year to enter the American AI semiconductor market, including terafab facilities.In terms of specific new products, Hanimi plans to launch the BOC COB Bonder for stacked memory, the 2.5D Thermal Compression (TC) Bonder for AI system semiconductors, and a Wide TC Bonder.Hanmi has also doubled its corporate governance compliance rate year-over-year and conducted tax-free dividends for fiscal 2025, achieving an 11.1% growth in total dividends and a 35.5% payout ratio.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":true,"editions":null,"column":"","sentiment":"0","news_tag":"corporation,productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"isLaohu8Offline":false,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.46.0","shortVersion":"4.46.0","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2652295277","isCrawlerRequest":true}