Intel Seeks Operating Partners for Ohio Chip Fab- Semafor

THOMSON REUTERS05:09

At the request of the copyright holder, you need to log in to view this content

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

  • Cedric77
    07:30
    Cedric77
    Intel's advanced packaging business is growing much faster than expected, but the bigger investment opportunity may not be Intel itself. The real winners could be packaging companies like ASE (日月光) and Amkor (AMKR) because they work with both Intel and TSMC. No matter which chipmaker wins the advanced packaging race, these companies are likely to get more business. Intel's EMIB and TSMC's CoWoS are similar technologies, but Intel currently has an advantage in making larger chip packages because it uses rectangular substrates instead of the round silicon wafers used by TSMC. However, this advantage may be temporary. As the industry moves to glass substrates, both companies could end up on a more level playing field. The key takeaway is: Don't focus only on Intel vs. TSMC. The safer long-ter
    • DonnaMay: 
      Glass substrate is only part of it — thermals and interconnect density matter more than shape here
Leave a comment
1
1