Samsung Electronics Signs $200 Billion MOU With Broadcom to Expand AI Chip Partnership

MT Newswires Live09:53

Samsung Electronics (KRX:005930) signed a memorandum of understanding with U.S.-based semiconductor and infrastructure software firm Broadcom worth $200 billion, the South Korean chipmaker said in a press release on Saturday.

The agreement is expected to broaden their partnership in memory and foundry operations to support next-generation AI infrastructure.

The five-year partnership was announced during South Korean President Lee Jae Myung's visit to San Francisco, where South Korean firms SK hynix (KRX:000660) and Naver (KRX:035420) also announced partnerships with US firms.

Shares of Samsung fell over 1% in recent trade.

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