UMC's Board OKs Singapore, Taiwan Phased Capacity Expansion Plan

MT Newswires Live07-29

United Microelectronics, or UMC (TPE:2303), said its board approved a phased capacity expansion plan that includes expanding cleanroom capacity at its Singapore P4 fab, as well as constructing the outer shell of a new wafer fab in Taiwan's Tainan Science Park.

The company said the investments will meet growing customer demand, support future AI and edge computing opportunities, according to a Wednesday Taiwan Exchange filing.

UMC said the Singapore investment will increase silicon photonics production capacity, while the new Tainan facility will support future P7 and P8 fabs, advanced packaging development, and strengthen supply chain resilience through a more geographically diversified manufacturing footprint.

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