Liquid Cooling Set to Become Standard in High-End AI Infrastructure
Dow Jones14:50
0650 GMT - Liquid cooling penetration among AI chips is projected to approach 60% by 2027, as next-generation AI hardware continues to push power and thermal requirements higher, according to research firm TrendForce. The firm says adoption is expected to rise from approximately 33% in 2025 to 53% in 2026, driven by continued investment in AI infrastructure and the rollout of new high-performance AI chips from Nvidia, AMD and Google. AMD is expanding its AI platform strategy with the Helios rack-scale solution, which is expected to enter large-scale shipments in 2027, while the next-generation MI500 platform is being developed to compete with Nvidia's Rubin Ultra, TrendForce says.
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