Taiwan Semiconductor Manufacturing (TSM) and ASML (ASML) are collaborating on a project to move chipmaking to larger numerical aperture extreme ultraviolet masks, the companies said Tuesday.
The two chipmakers want to move to 12-inch photomasks following the use of six-inch masks, with the aim of having a pilot production line ready by 2031 and full production by 2033, the companies said.
Other players and suppliers appear interested in joining in the effort, the companies said.
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