ASML (ASML) and Samsung Electronics said Tuesday that they will expand their partnership to advance High NA EUV lithography and semiconductor manufacturing for next-generation chips.
The company said Samsung will join an industry effort to develop 12-inch photomasks for High NA EUV systems, which could improve chip production efficiency and reduce costs compared with the current 6-inch format.
Samsung also plans to use ASML's High NA EUV technology in high-volume DRAM production by 2028, it added.
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