BIWIN Storage Technology (SHA:688525) and subsidiary Guangdong Xincheng Hanqi Semiconductor Technology will expand their investment in a chip packaging and testing facility by 4.5 billion yuan, according to a Wednesday filing with the Shanghai bourse.
Of the amount, 4 billion yuan will go to fixed-asset investments, including buildings and structures, slated for construction before Dec. 31, 2029.
Shares in the chip company rose 3% during morning trading on Wednesday.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.
Comments