Be Semiconductor Could Face Weaker-than-Expected Demand for Hybrid Bonding Tech
Dow Jones10-07
0829 GMT - Dutch supplier of semiconductor assembly equipment BE Semiconductor Industries might face lower-than-expected adoption of hybrid bonding technology in the coming years, UBS analysts write in a research note. Hybrid bonding technology combines multiple materials and components at the microscopic level to create advanced semiconductor packages. "Our bottom up work suggests consensus is overestimating the hybrid bonding opportunity in both memory and logic applications, and we see downside risk to numbers," analysts say. They downgrade their rating on the stock to sell from buy and their price target to 159 euros from 370 euros. BE Semiconductor shares trade 5.8% lower at 180.85 euros.
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