Nvidia (NVDA) is leaning towards using Taiwan Semiconductor Manufacturing's (TSM) 3-nanometer logic process and production capacity in the base die component of its planned high-bandwidth memory chip called NVHBM, Seoul Economic Daily reported Sunday, citing industry sources.
The base die is a key component of the chip, which Nvidia is co-designing with Taiwan Semiconductor and Samsung Electronics, according to the report.
The companies did not immediately respond to MT Newswires' requests for comments.
(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)
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