TCL to Issue Up to 3 Billion Yuan Sci-Tech Bonds

MT Newswires Live10-21 10:16

TCL Technology (SHE:000100) is looking to issue up to 3 billion yuan in technology innovation corporate bonds, according to a Tuesday after-hours filing with the Shenzhen bourse.

The bonds are divided into three-year and five-year tranches. Proceeds will help repay bank loans and debts to subsidiaries.

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