TCL Technology (SHE:000100) issued up to 3 billion yuan of science and technology innovation corporate bonds in two tranches, according to a Friday after-hours filing with the Shenzhen bourse.
The first tranche amounted to 2 billion yuan with a three-year term and a coupon rate of 1.77% and was oversubscribed 1.69 times.
The second tranche raised 1 billion yuan with a five-year term and a coupon rate of 1.95%. Oversubscription was 1.72 times.
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