Market Chatter: Samsung Electronics Breaks Ground on New Semiconductor Packaging Facility in Asan

MT Newswires Live11-12

Samsung Electronics (KRX:005930) held a groundbreaking ceremony on Thursday for a new semiconductor packaging facility at its Onyang campus in Asan, South Chungcheong province, The Korea Times said in a same-day report.

The new facility is part of a 144 trillion won investment plan by Samsung Electronics and three affiliates to expand advanced manufacturing capacity in the region, the report said.

The new production line will add high-bandwidth memory packaging capabilities to the campus and is scheduled to start operations in June 2028, it said.

Shares of Samsung Electronics rose nearly 1% at market close.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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