$Taiwan Semiconductor Manufacturing(TSM)$ Advanced packaging like TSMC's CoWoS and InFO goes beyond traditional packaging. It allows chips to be stacked and interconnected on a silicon interposer, creating a single powerful unit.
This is crucial for advanced wafer processes because:
Smaller chips, bigger performance: Modern chip manufacturing gets expensive at the bleeding edge. Advanced packaging lets you combine smaller, more efficient chips to achieve high performance.
Mixing and matching: You can integrate chips made with different processes (e.g., high-performance logic and efficient memory) in one package.
Essentially, advanced packaging helps squeeze even more power and functionality out of modern chips.
Apple and Nvidia use 2um and 4um process for their chip. Currently TSMC is the only one can do this process. So the growth for TSMC is huge. Do you own due diligence check before invest @MillionaireTiger @TigerStars @TigerClub @TigerEvents @Tiger_SG @Daily_Discussion
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Thank u so much for sharing your insights with tigers on TSMC and congrats on your 40% gains!👍👍
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