$Taiwan Semiconductor Manufacturing(TSM)$ 's capabilities speak volumes. The HBM order backlog from $Micron Technology(MU)$ and SK Hynix directly indicates revenue growth in their high-margin advanced packaging and HPC segments. Since HBM and high-end AI processors are physically integrated, they're inseparable. This symbiotic relationship creates synchronized order growth across both industries. Remember, every HBM order inherently requires a corresponding logic chip. $Taiwan Semiconductor Manufacturing(TSM)$ 's CoWoS may not get much spotlight, but the entire AI chip sector grinds to a halt without it.
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