$英伟达(NVDA)$ VERA RUBIN SUPPLY CHAIN
Rubin is becoming a system-level buildout with rising content across memory, packaging, networking, power and cooling pushing the opportunity well beyond the GPU:
• Memory sits with$美光科技(MU)$ ,$SK海力士(SKHY)$ & Samsung supplying the DRAM & HBM feeding Rubin accelerators while $闪迪(SNDK)$ adds exposure to storage layer around AI systems
• Advanced packaging runs through$台积电(TSM)$ ，$艾马克技术公司(AMKR)$ &$英特尔(INTC)$ for foundry, packaging & assembly while$应用材料(AMAT)$ ,$拉姆研究(LRCX)$ ,$科磊(KLAC)$ ,$阿斯麦(ASML)$ ,$泰瑞达(TER)$ &$Aehr Test Systems(AEHR)$ provide equipment & testing needed to manufacture complex AI chips
• Optical networking spans$Coherent(COHR)$ ,$Lumentum Holdings Inc.(LITE)$ &$Applied Optoelectronics Inc.(AAOI)$ in optical modules,$博通(AVGO)$ &$迈威尔科技(MRVL)$ in switching silicon,$Credo Technology Group Holding Ltd(CRDO)$ &$Astera Labs, Inc.(ALAB)$ in high-speed connectivity &$康宁(GLW)$ ,$Ciena科技(CIEN)$ ,$诺基亚(NOK)$ &$Arista Networks, Inc.(ANET)$ across fiber & network infrastructure
• 800VDC power reaches from power semiconductors with$意法半导体(STM)$ ,$安森美半导体(ON)$ ,$纳微半导体(NVTS)$ ,$帕沃英蒂格盛(POWI)$ &$Wolfspeed Inc.(WOLF)$ into power management with$Monolithic Power Systems(MPWR)$ ,$亚德诺(ADI)$ ,$德州仪器(TXN)$ & $Vicor Corporation(VICR)$
• Power infrastructure & cooling sit downstream with$Vertiv Holdings LLC(VRT)$ ,$伊顿(ETN)$ &$GE Vernova Inc.(GEV)$ supplying electrical distribution, backup power & thermal systems needed as rack densities keep rising
• Compute systems bring full rack together through$戴尔(DELL)$ ,$慧与科技(HPE)$ &$超微电脑(SMCI)$ which integrate Nvidia compute, networking, memory & power into deployable AI systems
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