@Success88:$Taiwan Semiconductor Manufacturing(TSM)$  Advanced packaging like TSMC's CoWoS and InFO goes beyond traditional packaging. It allows chips to be stacked and interconnected on a silicon interposer, creating a single powerful unit. This is crucial for advanced wafer processes because: Smaller chips, bigger performance: Modern chip manufacturing gets expensive at the bleeding edge. Advanced packaging lets you combine smaller, more efficient chips to achieve high performance. Mixing and matching: You can integrate chips made with different processes (e.g., high-performance logic and efficient memory) in one package. Essentially, advanced packaging helps squeeze even more power and functionality out of modern chips. Apple