The company established its headquarters in Xingcheng Science and Technology Park, Danshui Subdistrict, Huiyang District, in July 2006. In June 2015, it was listed on the ChiNext Board of the Shenzhen Stock Exchange. Its products are widely used in high‑growth sectors such as artificial intelligence, new energy vehicles, and high‑speed network communications. Relying on forward‑looking strategic planning and outstanding technology commercialization capabilities, the company has continuously pushed the boundaries of cutting‑edge PCB technologies, developed a diversified product portfolio, and built a comprehensive product lineup covering single‑layer and double‑layer PCBs, high‑multilayer PCBs, advanced HDI boards, and FPCs. The company is dedicated to the R&D, production, and sales of high‑density printed circuit boards. Its main product offerings include a full range of rigid circuit boards—centered on multilayer boards and HDI—and flexible circuit boards—including single‑ and double‑sided boards, multilayer boards, and rigid‑flex hybrid boards. Corporate honors include: Top 500 Enterprises in Guangdong Province (ranked 339th), a Key High‑Tech Enterprise under the National Torch Program, a National Intellectual Property Advantage Enterprise, a National Innovative Enterprise in the Electronic Information Industry, an Innovative Enterprise in Guangdong Province, and a Guangdong Provincial Demonstration Enterprise for Intellectual Property. The company operates a provincial-level New R&D Institution, a provincial-level Engineering R&D Center, and an Enterprise Technology Center, with 802 professional R&D personnel and strong research capabilities. In 2015, the company successfully obtained certification under the GB/T29490–2013 "Enterprise Intellectual Property Management Standards" system. To date, the company has accumulated a total of 250 patents, including 73 invention patents.