For me, the biggest opportunity isn’t simply the $2.3T semiconductor forecast—it’s identifying where AI infrastructure hits its next bottleneck.
GPUs capture attention, but HBM, advanced packaging, and networking determine how efficiently that computing power translates into real performance. As models grow larger, memory bandwidth and packaging capacity could become increasingly valuable.
The critical question is whether supply can keep pace without destroying pricing power. Today’s shortage creates attractive margins, but tomorrow’s aggressive capacity expansion could trigger another semiconductor downcycle.
I’m watching HBM and advanced packaging most closely. The winners may not always be the companies building the most powerful chips, but those controlling the components the entire ecosystem cannot operate without.
@Capital_Insights [你懂的]
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