Xi’An Eswin Material Technology Co., Ltd. (688783.SH) announced that it has signed an investment cooperation agreement with Wuhan Optics Valley Semiconductor Industry Investment Co., Ltd. for the Eswin Wuhan Silicon Material Base Project. The project will focus on producing 12-inch silicon single-crystal polished wafers and epitaxial wafers for advanced integrated circuit processes, suitable for logic chips, flash memory chips, DRAM, image sensors, display driver chips, and other applications.
The total investment in the project is approximately 12.5 billion yuan (final investment amount subject to actual expenditures), with 8.5 billion yuan in capital and the remaining 4 billion yuan to be financed through bank loans by the project company. The planned production capacity is 500,000 wafers per month, targeting 12-inch silicon wafers for advanced semiconductor manufacturing.
This collaboration with Optics Valley Semiconductor Industry Investment aims to expand the company's existing capacity, aligning with its strategic development plan. Upon completion, the project will add over 500,000 wafers per month, bringing the company's total capacity to approximately 1.7 million wafers per month.
The expansion will strengthen Eswin's leading position in China, enhance its ability to serve customers in Central China, and extend its reach to the Yangtze River Delta and Pearl River Delta regions. Additionally, it will improve global customer service capabilities, increase economies of scale, and further boost investor returns.
