TSMC and Arizona Discussing Advanced Chip Packaging Investment

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TSMC and Arizona Discussing Advanced Chip Packaging Investment

Bloomberg2023-09-19

Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker’s plants in the state, Governor Katie Hobbs said in Taipei on ...

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Under Secretary of Commerce Laurie E. Locascio said the US is talking to TSMC about research and development for the first time, in an effort to bring more of the world’s biggest contract chipmaker’s technology onshore.Packaging has become a bottleneck in the fabrication of the most in-demand silicon today, Nvidia Corp.’s artificial intelligence accelerators, made by TSMC. The Hsinchu-based company has committed to expanding its packaging capacity in Taiwan, but expects supplies to be tight for another 18 months, Chairman Mark Liu said at Semicon earlier this month. At the same event, Cadence Design Systems Inc. Chief Executive Officer Anirudh Devgan said packaging will be the key battleground for nations seeking to establish tech leadership.TSMC’s commitment to Arizona now spans two fabs and $40 billion in investment, and adding advanced packaging to that endeavor would again raise the ceiling on what’s possible to produce there. 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