SK hynix Inc. announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth memory(HBM) package for next-generation HBM products.
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Heat management has become a critical challenge as HBM technology advances with higher stacking and faster speeds to cater to the surging demand for AI data processing.
The efficient management of power density in the Die-to-Die Physical Layer (D2D PHY) —the interface connecting HBM and GPU—has emerged as a key factor defining the competitiveness of next-generation HBM.
With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional 'heat dissipation path'. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.
