AMD苏姿丰：5nm制程产品预计明年推出样品

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AMD苏姿丰：5nm制程产品预计明年推出样品

界面2021-06-01

台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...

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91杨先生
·2021-06-01
AMD YES
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Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/fab3e6da33eab070d39ea5ddbb760010","relate_stocks":{"AMD":"美国超微公司"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2140804462","content_text":"台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。","news_type":1},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"}],"hasMoreComments":true,"newsSizeData":{"likeSize":0,"commentSize":1,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false}}