特斯拉刚刚召开了他们的人工智能日,并透露了其软件和硬件基础设施的内部工作原理。此次公开的部分一是之前公开的Dojo AI训练芯片。特斯拉称他们的 D1 Dojo 芯片具有 GPU 级别的计算能力、CPU 级别的灵活性,以及网络交换机IO。 几周前,我们推测该系统的封装是 TSMC 晶圆集成扇出系统 (InFO_SoW)。我们解释了这种类型的封装的好处以及这种大规模扩展训练芯片所涉及的冷却和功耗。...
Source Link半导体行业观察2021-08-21
特斯拉刚刚召开了他们的人工智能日,并透露了其软件和硬件基础设施的内部工作原理。此次公开的部分一是之前公开的Dojo AI训练芯片。特斯拉称他们的 D1 Dojo 芯片具有 GPU 级别的计算能力、CPU 级别的灵活性,以及网络交换机IO。 几周前,我们推测该系统的封装是 TSMC 晶圆集成扇出系统 (InFO_SoW)。我们解释了这种类型的封装的好处以及这种大规模扩展训练芯片所涉及的冷却和功耗。...
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