$Micron Technology(MU)$ All the HBM for fully booked even in 2025 is the problem of pakaging.The order for HBM must take half a year. For after stacking up DRAM, must send to TSMC's CoWas Packaging Fabs for bonding with Nvida's Chip. The world has only one COWAS packaging Fab. Another new built Package Fab can work in the begining of 2025. Two another new will build and work in2026. The DRAM chips is not the problem.
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