$NVIDIA Corp(NVDA)$ Godan Morre's doctron is expired in 1 nm. Now for HPC and AI GPU need advanceded packageing like TSMC's COWAS and 3DIC. Nvda has ordered to 2025 to TSMC using Cowas package. While AMD also places order with TSMC by using 3DIC packaging. Hynix will invet 14 billions in US to build advaced package. TSMC's Cowas can bond 2 GPU and 60pc HBM.

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