All three major DRAM makers—Samsung, Micron $MU, and SK Hynix—are ramping up HBM (high bandwidth memory) production due to strong AI demand.
This surge has led Applied Materials to boost production, with orders filling factories at their Taiwan partner, Foxsemicon, through Q2 2025.
High Performance Computing (HPC) chip manufacturers, like NVIDIA, are driving this demand, booking advanced process capacity at TSMC. Foxsemicon's revenue is up, reflecting this strong order momentum, and growth is expected to continue into next year.
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