$Taiwan Semiconductor Manufacturing(TSM)$
Computing power, storage capacity, and advanced packaging are all experiencing rapid growth. The key to advanced packaging lies in cutting-edge technologies. NVIDIA's $NVIDIA Corp(NVDA)$ GPU output depends on how much advanced packaging TSMC can produce with its COWOS technology. NVIDIA has tasked TSMC with expanding its advanced packaging capabilities to address GPU shortages. The semiconductor testing and packaging industry is poised for significant catalysts, driven by multiple factors that are igniting advanced packaging.
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