$FIT HON TENG(06088)$ Broadcom $Broadcom(AVGO)$ is on fire again，their next-gen Tomahawk 6 switch chips are already shipping, and demand is off the charts! Their partnership with Foxconn Interconnect (FIT) has gone from simple business restructuring to deep tech collaboration, especially in CPO (co-packaged optics). Together, they’ve built a full pipeline from R&D to mass production. This is a big win for AI data center interconnects, and with the 200G CPO platform coming, this duo is just getting started.
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