$SK hynix(SKHY)$ SK Hynix is putting over $4B into an HBM production hub in Indiana, and they have signed an MOU with Purdue.

The company held a ceremony for an advanced packaging production facility for AI memory at Purdue's Holloway Gymnasium in West Lafayette, Indiana. The Indiana fab is expected to open its cleanroom by October 2028 and start mass production of HBM in the second half of 2029. Once commercial operations get going, the plan calls for a workforce of around 1,000 people. This is SK Hynix's first HBM production base in the U.S., and the setup is designed to work closely with their production in South Korea.

Wafers made by SK Hynix in Korea will be shipped to Indiana for advanced packaging and testing, with the finished Made in USA products then supplied to U.S. customers. There will also be an Advanced Packaging R&D Testbed built alongside the production lines, giving customers, universities, and business partners a place to work together on packaging technology development, prototype fabrication, and performance validation.

The project is expected to create around 7,000 direct and indirect jobs with local and national companies during construction and later commercial operations. At the groundbreaking ceremony, SK Hynix also signed an MOU with Purdue University for R&D collaboration in advanced packaging. Through that agreement, both sides will strengthen R&D cooperation and jointly research system integration and advanced packaging technologies, including HBM. SK Hynix also plans to expand efforts on cultivating and recruiting talent from across the Midwest.

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