AMD YES-To The Moon - Tiger Brokers Online Investing Community - To The Moon

Like
Comment
Favorite

91杨先生
2021-06-01

AMD YES

AMD苏姿丰：5nm制程产品预计明年推出样品

台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。

AMD苏姿丰：5nm制程产品预计明年推出样品

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Like

Report

Comment

Top
Latest

empty

No comments yet

Most Discussed

Terms and Conditions·Privacy Policy

Company: TTMF Limited. Tech supported by Xiangshang Yixin.

Email：uservice@ttm.financial

{"i18n":{"language":"en_US"},"data":{"magic":2,"id":119448096,"tweetId":"119448096","gmtCreate":1622561074215,"gmtModify":1704186414535,"author":{"id":3507797313824904,"idStr":"3507797313824904","authorId":3507797313824904,"authorIdStr":"3507797313824904","name":"91杨先生","avatar":"https://static.tigerbbs.com/dc270a8978e8af1ab985ac1856b50915","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"fanSize":0,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"extraTitle":"","html":"<html><head></head><body><p>AMD YES&nbsp;</p></body></html>","htmlText":"<html><head></head><body><p>AMD YES&nbsp;</p></body></html>","text":"AMD YES","highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://ttm.financial/post/119448096","repostId":2140804462,"repostType":2,"repost":{"id":"2140804462","pubTimestamp":1622546820,"share":"https://www.laohu8.com/m/news/2140804462?lang=&edition=full","pubTime":"2021-06-01 19:27","market":"us","language":"zh","title":"AMD苏姿丰：5nm制程产品预计明年推出样品","url":"https://stock-news.laohu8.com/highlight/detail?id=2140804462","media":"界面","summary":"台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。","content":"<div>\n<p>台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b\">Web Link</a>\n\n</div>\n","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD苏姿丰：5nm制程产品预计明年推出样品</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD苏姿丰：5nm制程产品预计明年推出样品\n</h2>\n\n<h4 class=\"meta\">\n\n\n2021-06-01 19:27 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b><strong>界面</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/fab3e6da33eab070d39ea5ddbb760010","relate_stocks":{"AMD":"美国超微公司"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2140804462","content_text":"台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。","news_type":1},"isVote":1,"tweetType":1,"viewCount":177,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["AMD"],"verified":2,"subType":0,"readableState":1,"langContent":"EN","currentLanguage":"EN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":6,"xxTargetLangEnum":"ORIG"},"commentList":[],"hasMoreComment":false,"orderType":2}