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臺積電計劃年底將4nm工藝轉移到風險生產,並於2022年量產

@美股研究社
美股研究社消息,據IT之家報道,$臺積電(TSM)$ 今年四月更新了其最新的製程工藝路線圖,其 4nm 工藝將會在2021年底進入“風險生產”階段,並於2022年量產,而3nm芯片依然是定在 2022 年下半年投產,且2nm工藝正在開發當中。 知名供應鏈媒體 DigiTimes 援引消息人士消息,臺積電先進工藝全面提速,在持續使用大量 EUV 設備提高生產力與效能後,已全面鞏固在EUV的領先地位,受此影響,供應鏈企業新思、應材供應鏈雨露均沾。 此外,臺積電將在2021年第三季度將 N4(即5nm的加強版,或稱4nm)轉移到風險生產階段,而其N3技術開發正按計劃進行,計劃於2022年下半年量產。 本文來源:美股研究社,轉載請註明版權
臺積電計劃年底將4nm工藝轉移到風險生產,並於2022年量產

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