擴產能，降成本！意法半導體製造首批200mm碳化硅晶圓

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擴產能，降成本！意法半導體製造首批200mm碳化硅晶圓

芯药研究所
2021-07-27

意法半導體（簡稱ST）今天宣佈，ST瑞典北雪平工廠製造出首批200mm (8寸)碳化硅(SiC)晶圓片，這些晶圓將用於生產下一代電力電子芯片的產品原型。SiC晶圓升級到200mm標誌着ST面向汽車和工業客戶的擴產計劃取得重要的階段性成功，鞏固了ST在這一開創性技術領域的領導地位，提高了電力電子芯片的輕量化和能效，降低客戶獲取這些產品的總擁有成本。

意法半導體先進的量產碳化硅產品STPOWER SiC目前是在卡塔尼亞（意大利）和宏茂橋（新加坡）兩家150mm晶圓廠完成前工序製造，後工序製造是在深圳（中國）和布斯庫拉（摩洛哥）的兩家封測廠進行的。這個階段性成功是意法半導體佈局更先進的、高成本效益的200mm SiC量產計劃的組成部分。SiC晶圓升級到200mm屬於公司正在執行的SiC襯底建新廠和內部採購SiC襯底佔比超40%的生產計劃。

來源：ST

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edwardkoh626
·2021-08-03
Bigger SIC wafers mean reduce cost per dice.
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